专利名称：Housing of electronic device and electronic
device using the same
发明人：Bin Li,Chao-Hsun Lin,Jen-Lung Huang,Xian-Liang Liu,Gui-Yun Yang
申请号：US12275315申请日：20081121公开号：US07989085B2公开日：20110802
专利附图：
摘要：An exemplary housing of electronic device includes a metallic main body and ametallic three-dimensional woven member formed on at least a part of a surface of the
metallic main body. An electronic device using the housing is also provided. The housingof the electronic device has a textured touching feeling.
申请人：Bin Li,Chao-Hsun Lin,Jen-Lung Huang,Xian-Liang Liu,Gui-Yun Yang
地址：Shenzhen CN,Taipei TW,Taipei TW,Shenzhen CN,Shenzhen CN
国籍：CN,TW,TW,CN,CN
代理人：Steven M. Reiss
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容
Copyright © 2019- huatuowenda.com 版权所有 湘ICP备2023022495号-1
违法及侵权请联系：TEL:199 1889 7713 E-MAIL:2724546146@qq.com
本站由北京市万商天勤律师事务所王兴未律师提供法律服务